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Board components

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Featured devices

The board features several NXP ICs:

  • MC33772: 6-Channel Li-Ion battery cell controller IC designed for automotive and industrial applications such as HEV, EV, ESS, UPS systems. The MC33772 allows ADC conversions on the differential cell voltages and currents as well as coulomb counting and temperature measurements. It features embedded balancing transistors and diagnostics to simplify applications. The device supports standard SPI and transformer isolated daisy chain communication (via MC33664) to an MCU for processing and control

  • S32K144: AEC-Q100 certified microcontroller for general purpose automotive applications. The S32K144 features an Arm® Cortex®- M4F core, 512 KB of Flash, CAN/CAN-FD controllers, security module complying with SHE specification and is offered in LQFP-48, LQFP-64, LQFP-100 and MAPBGA-100 packages supporting an ambient temperature range from -40°C up to 125°C

  • UJA1169: Mini high-speed CAN System Basis Chip (SBC) containing an ISO 11898-2:201x (upcoming merged ISO 11898-2/5/6) compliant HS-CAN transceiver and an integrated 5V or 3.3V 250 mA scalable supply (V1) for a microcontroller and/ or other loads. It also features a watchdog and a Serial Peripheral Interface (SPI). The UJA1169 can be operated in very low-current Standby and Sleep modes with bus and local wake-up capability

  • A1007: A1007 authentication IC is a secure solution built with many tamper resistant features and security countermeasures to deter common invasive and non-invasive attacks

  • NTAG5: NXP’s NTAG 5 boost shrinks the NFC footprint while adding AES security, so designers can deliver ultra-compact devices for use in IoT, consumer, and industrial applications

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IC board location identifiers

The main ICs featured are listed in the table below:

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Connectors

The following figure shows the location of the connectors on the board.

All connectors implemented on RDDRONE-BMS772 are detailed in the table below:

Note: Hardware configuration of the board is done via 16 jumpers to solder (SJxx). See , and for more details.

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Communication with Flight Management Unit

The RDDRONE-BMS772 board can communicate with a host device such as a PX4 Flight Management Unit (FMU) using the SMBus bus (can also be used as a simple I²C bus, connector J18) or the UAVCAN bus (can also be used as a simple CAN bus, connectors J3 and J20).

Note: For further information about UAVCAN, look for enablement in PX4.io software.

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Programming and debug

There are two ways to program and debug the RDDRONE-BMS772 board:

  • through the DCD-LZ connector (J19)

  • through the JTAG connector (J2)

Note: The DCD-LZ combines a debug interface with a debug serial console. It is used on RDDRONE-FMUK66 (HoverGames). For more information see the

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LED

The RDDRONE-BMS772 implements a programmable RGB LED. Various color combination and blink patterns can be used to indicate the state of the battery and system.

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Button

The side button is a wake button, it connects the WAKE pin of the SBC to the ground when pressed. The J22 header placed in parallel of the side button can be used as an alternative if an extended or panel mount button is needed.

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Display

An external display could be used to display important (battery) information. This display can be connected to J23, the I²C master bus. This header could be supplied with 3.3V (D34) or 5V (D35, default populated). By switching the diode, 3.3V or 5V could be used.

circle-check

Some recent versions of the board may include a small common

  • These displays work at both 3.3V and 5V. Software has been prepared but requires connection to the 3.3V domain (D34)

Example of 0.91 inch OLED display using SSD1306 I2C display controller

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External and additional components

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External components

An optional external temperature sensor can be added onto the RDDRONE-BMS772 board using connector J1. An example of application for this external sensor can be to monitor the cells temperature inside the battery pack.

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Additional components

Some components are included in the design but are not mounted on the RDDRONEBMS772 original board. They are marked "DNP" on the schematics and the BOM. The following table is giving the list of additional components that can be implemented in the design as well as their use:

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Test point definitions

The following figure shows the location of the test points on the board.

A1007

U5

Near-Field Communication (NFC)

J2

JTAG debugger

-

E.g.: FTS-105-01-F-D from SAMTEC

Populated

J3

CAN bus

JST MFG. CO

SM04B-GHS-TB(LF)(SN)

Populated

J4

Battery power input

-

E.g.: FIT0588 from DFRobot

DNP

J5

Battery power output

-

E.g.: FIT0588 from DFRobot

DNP

J6

Reset jumper

FCI

68000-202HLF

Populated with jumper mounted

J18

SMBus (I²C slave bus)

JST MFG. CO

SM04B-GHS-TB(LF)(SN)

Populated

J19

DCD-LZ debugger

JST MFG. CO

SM07B-GHS-TB(LF)(SN)

Populated

J20

Additional CAN bus

JST MFG. CO

SM04B-GHS-TB(LF)(SN)

Populated

J21

MCU expansion header

HARWIN INC.

M50-3530842

DNP

J22

Wake jumper

FCI

68000-202HLF

DNP

J23

I²C master bus

FCI

68000-204HLF

Populated

Double check the pinout configuration as they occasionally differ. Most use 1-GND, 2-
  • VCC, 3-SCL, 4-SDA and will connect directly to header J23 without modification.

  • C6, C12, C18, C22, C26, C29, C34

    Capacitors on external temperature sensor

    If the external temperature sensor is implemented, two capacitors can be added on the external temperature sensor low pass filter for more EMC demanding applications

    C49, C54

    Capacitor on cell balancing connections

    Capacitors can be added on the cell balancing circuit for EMC, according to the number of cell in use

    C99, C100, C101, C102, C103, C104, C105, C106, C107

    External NFC antenna

    Coil as an alternative option for the PCB NFC antenna for extended range operations

    L2

    Resistor on gate driver RS pin

    Resistor to link RS pin on gate driver to MCU

    R99

    MCU expansion header

    Additional MCU pins are wired to a 1x8 header slot. Potential to use additional battery level LEDs, emergency button, etc.

    J21

    Wake jumper

    Jumper for SBC wake-up. In parallel of the button

    J22

    SBC 3.3 V regulator output

    TP5

    RST_N

    Reset signal (active low)

    TP6

    CAN_LO

    CAN Low signal

    TP7

    CAN_HI

    CAN High signal

    TP8

    VCC_3V3_LDO1

    LDO 3.3 V regulator output

    TP9

    SMBUS_SCL

    SMBus I²C bus clock signal

    TP10

    SMBUS_SDA

    SMBus I²C bus data signal

    TP11

    VBAT_IN

    Power input

    TP12

    VBAT_OUT

    Power output

    TP13

    GND

    Ground reference of the device

    TP14

    N/A

    Power switches gate command

    TP16

    BCC_MISO

    BCC SPI MISO line

    TP17

    BCC_CS

    BCC SPI chip select

    TP18

    BCC_SCLK

    BCC SPI clock signal

    TP19

    BCC_MOSI

    BCC SPI MOSI line

    TP20

    SBC_CS

    SBC SPI chip select

    TP21

    SBC_MISO

    SBC SPI MISO line

    TP22

    SBC_MOSI

    SBC SPI MOSI line

    TP23

    SBC_SCLK

    SBC SPI clock signal

    TP24

    VCC_HARVEST

    The VOUT pin of the NTAG (voltage harvest)

    TP25

    N/A

    Connected to J18[1] of SMBus connector

    Label

    Description

    Reference

    U1

    Battery Cell Controller (BCC)

    MC33772BSP1AEarrow-up-right

    U2

    Micro-Controller Unit (MCU)

    FS32K144HAT0MLFTarrow-up-right

    U3

    System Basis Chip (SBC)

    UJA1169TK/F/3arrow-up-right

    U4

    Label

    Description

    Manufacturer

    Reference

    Placed or DNP

    JP1

    Cell terminal connector

    JST MFG. CO

    SxB-XH-A(LF)(SN)

    DNP

    J1

    External temperature sensor

    JST MFG. CO

    SM02B-GHS-TB(LF)(SN)

    Feature

    Description

    Label

    Additional MOSFETs

    If the application requires more power, two pairs of back to back MOSFETs can be added on the bottom side of the board. Corresponding part is PSMNR70-30YLH. See Configuring the hardware

    Q3, Q4, Q7, Q8

    Heatsinks

    In order to dissipate more power, four additional heat-sinks can be mounted: two on the top side and two on the bottom side of the board. Recommended part is FK 244 08 D2 PAK

    HS1, HS2, HS3, HS4

    Optional termination resistor network on CAN bus

    One 60.4 Ω resistor on each CAN line connected to a 4700 pF capacitor wired to the ground

    R49, R50, C66

    Capacitors on cell measurements connections

    Label

    Signal name

    Description

    TP1

    OVERCURRENT

    Overcurrent signal

    TP2

    AUTH_NFC_SCL

    Authentication and NFC I²C bus clock signal

    TP3

    AUTH_NFC_SDA

    Authentication and NFC I²C bus data signal

    TP4

    Cell terminal connection
    Shunt resistor
    External NFC antenna
    HoverGames gitbook.arrow-up-right
    0.91 inch OLED display using SSD1306 controller. arrow-up-right
    Connectors placements (top and bottom)
    Test points (Top)
    Test points (Bottom)

    Authentication

    Populated

    A filter can be added to the cell voltage measurements connections, according to the number of cells in use

    VCC_3V3_SBC

    NTA53321G10FHKarrow-up-right